Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
Electronics Forum | Thu Feb 24 00:37:08 EST 2022 | joshsvoboda
I have a pcb with an ENIG finish that is using a 144 pin LQFP and being soldered withSN100C/NC258 T4 paste. I used a oven profiler where the probes are taped down to the joint and the profiling software adjusts the program for the best profile for
Electronics Forum | Thu Feb 24 15:36:34 EST 2022 | dontfeedphils
Looks like a decent profile. Only recommendation I have would be to possibly try and high-temp solder the thermocouples rather than the aluminum tape/kapton, only because you can get air-gaps and inaccurate readings using the tape method on assemble
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | Screen Printers
Used MPM UP2000HIE Automatic Solder Paste Printer Specification Board range : 50*50-508*406(mm) Board transmitting speed: 1524mm/second Track from the ground level: 876-1041(mm) Printing area: 457-406(mm) Printing speed: 6.35-305(mm/second) P
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: SMC Part Name: Cylinder Part Number: J90650160C Model: CJ2R10-8.3B-KRJ Origin: China Condition: Original New J90650160C Feeder Cylinder For Samsung SM8mm Feeder 8mm feeder cylinder Deatail Information: 1,
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
The biggest, baddest, most affordable Nitrogen Capable BGA Rework Station demonstrated by Dennis O'Donnell the BGA Expert! Safe, precision rework for SMD, BGA, and LED chips on boards as large as 36" or more!. The versatile E6250U rework station co
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Beaumont, Michigan, Minnesota, Canada USA | Engineering
Infrared camera electronics design and camera design engineer. Manage electronic design, research and development, optimize current design, manage prototype design, fabrication and testing. Some optical design experience is preferred, but not not nec
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
SMTnet Express, September 11, 2014, Subscribers: 23214, Members: Companies: 14043, Users: 36809 Reliability of Reworked QFNs. Bob Wettermann; Business Electronics Soldering Technologies (BEST) Inc. Recently, the impact of leadless device
.gif)
